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Thermal Management
Thermal Management

Thermal Management

Honeywell’s Heat Spreaders and Thermal Interface Materials are designed to meet the critical needs of electronics industry.

Thermal interface materials (TIMs) are widely employed to manufacture the most critical parts in the heat dissipation system, to cool and protect integrated circuit (IC) chips. Honeywell TIMs are based on proprietary technologies of polymer matrices and thermally conductive fillers, enabling them to handle challenging heat dissipation issues with long-term reliability and low cost of ownership. TIMs portfolio is designed to meet the critical needs of electronics industry.

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Phase Change Materials

Phase Change Materials

Phase Change Materials (PCM) are often used as matrix materials for thermal interface applications.
Thermal Gap Filler Pads

Thermal Gap Filler Pads

Honeywell Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications.
Thermal Putty Pads

Thermal Putty Pads

Honeywell Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability.
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