Phase Change Materials
PCM45F
PCM45F is a Phase Change Pad with a Thermal Impedance of 0.09 – 0.12 (°C cm²/w), Thermal Conductivity of 2 (w/mk) and Specific Gravity of 2.2 (g/cm³).
Please sign in to access more documents
Once signed in, you may be able to access additional documents for your account.
Overview
PCM45F is Solstice's thermally conductive phase change pad. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing for long product life applications. In addition, it has excellent electrical properties and very high-volume resistivity.
PCM45F has a Thermal conductivity of 2.0 - 2.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.09-0.12), making it desirable for high-performance integrated circuit devices.
PCM45F has a Thermal conductivity of 2.0 - 2.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.09-0.12), making it desirable for high-performance integrated circuit devices.
Typical Properties
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.2 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
- Viscosity
- N/A
- Liner Color
- Pink
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 2.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 8.2x1014 ohm-cm, Test Method ASTM D258
General Information
- Application
- Base Station
- Optical
- Switch
- Thin Bondline
- Transceiver
- Key Features
- High Reliability
- Typical Uses
- Action Cameras
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Router
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Smartphones
- Sub-segment
- Camera
- Networks
- Notebook
- Tablet
- Industry
- Technology and Telecommunications
Other
- Other Notes
- Pads available in sheets and rolls
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.2 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
- Viscosity
- N/A
- Liner Color
- Pink
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 2.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 8.2x1014 ohm-cm, Test Method ASTM D258
General Information
- Application
- Base Station
- Optical
- Switch
- Thin Bondline
- Transceiver
- Key Features
- High Reliability
- Typical Uses
- Action Cameras
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Router
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Smartphones
- Sub-segment
- Camera
- Networks
- Notebook
- Tablet
- Industry
- Technology and Telecommunications
Other
- Other Notes
- Pads available in sheets and rolls
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 2.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 2.2 g/cm3, Test Method ASTM D374
- Thickness (mm) : 0.20-1.00
- Liner Color : Pink
- Shelf Life : 12 months
- Viscosity : N/A
- Format : Pad
- Volume Resistivity : 8.2x1014 ohm-cm, Test Method ASTM D258
- Typical Uses : Action Cameras|IGBT|Lighting|Power control unit, inverter, onboard electronics|Router|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Smartphones
- Key Features : High Reliability
- Sub-segment : Camera|Networks|Notebook|Tablet
- Application : Base Station|Optical|Switch|Thin Bondline|Transceiver
- Industry : Technology and Telecommunications
- Other Notes : Pads available in sheets and rolls
Application Note
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/7/2025
316.14 KB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Data Sheet
Name
Description
File Size
Date
Size
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/7/2025
316.14 KB
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
900.68 KB
8/7/2025
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
For New Energy Vehicle Inverters
3.31 MB
6/12/2025
