Phase Change Materials
PTM5000
PTM5000 is a Phase Change Pad with a Thermal Impedance of 0.06 – 0.08 (°C cm²/w), Thermal Conductivity of 4.4 (w/mk) and Specific Gravity of 2.3 (g/cm³).
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Overview
PTM5000 is Solstice's thermally conductive phase change material in pad form. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing for long product life applications.
PTM5000 has a Thermal conductivity of 3.5 - 4.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices. Clamping pressure and temperature are suggested to achieve a minimum bondline thickness for the best performance. All information for thermal impedance is collected after the product is fully phase-changed without a shim.
PTM5000 has a Thermal conductivity of 3.5 - 4.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices. Clamping pressure and temperature are suggested to achieve a minimum bondline thickness for the best performance. All information for thermal impedance is collected after the product is fully phase-changed without a shim.
Typical Properties
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.3 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2
- 0.25
- 0.3
- 0.4
- 0.5
- Viscosity
- N/A
- Liner Color
- Pink
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
General Information
- Application
- CPU
- GPU
- Thin Bondline
- Typical Uses
- Action Camera
- Base Station
- Gaming
- IGBT
- Lighting
- Onboard Electronics
- Power Control Unit
- Router
- SSD
- Smartphones
- Switch
- VGA Cards
- Sub-segment
- AI/HPC
- Inverter
- Notebook
- PC
- Server
- Tablet
- Industry
- Consumer Electronics
Other
- Other Notes
- Pads available in sheets and rolls
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.3 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2
- 0.25
- 0.3
- 0.4
- 0.5
- Viscosity
- N/A
- Liner Color
- Pink
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 2.1x1014 ohm-cm, Test Method ASTM D259
General Information
- Application
- CPU
- GPU
- Thin Bondline
- Typical Uses
- Action Camera
- Base Station
- Gaming
- IGBT
- Lighting
- Onboard Electronics
- Power Control Unit
- Router
- SSD
- Smartphones
- Switch
- VGA Cards
- Sub-segment
- AI/HPC
- Inverter
- Notebook
- PC
- Server
- Tablet
- Industry
- Consumer Electronics
Other
- Other Notes
- Pads available in sheets and rolls
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 2.3 g/cm3, Test Method ASTM D374
- Thickness (mm) : 0.2|0.25|0.3|0.4|0.5
- Liner Color : Pink
- Shelf Life : 12 months
- Viscosity : N/A
- Format : Pad
- Volume Resistivity : 2.1x1014 ohm-cm, Test Method ASTM D259
- Typical Uses : Action Camera|Base Station|Gaming|IGBT|Lighting|Onboard Electronics|Power Control Unit|Router|SSD|Smartphones|Switch|VGA Cards
- Sub-segment : AI/HPC|Inverter|Notebook|PC|Server|Tablet
- Application : CPU|GPU|Thin Bondline
- Industry : Consumer Electronics
- Other Notes : Pads available in sheets and rolls
Application Note
Name
Description
File Size
Date
Size
In Modern Electronic Devices
application/pdf 316.14 KB
8/7/2025
316.14 KB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Data Sheet
Name
Description
File Size
Date
Size
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
In Modern Electronic Devices
application/pdf 316.14 KB
8/7/2025
316.14 KB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
900.68 KB
8/7/2025
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
For New Energy Vehicle Inverters
3.31 MB
6/12/2025
