Phase Change Materials
PTM6000-SP
PTM6000-SP is a Phase Change Paste with a Thermal Impedance of 0.06 - 0.08 (°C cm²/w), Thermal Conductivity of 4.4 (w/mk) and Specific Gravity of 2 (g/cm³)
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Overview
PTM6000-SP is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Like all phase change materials, it has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out. It can withstand temperatures up to 150°C.
PTM6000-SP has a Thermal conductivity of 4.4 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices.
PTM6000-SP has a Thermal conductivity of 4.4 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.06-0.08), making it desirable for high-performance integrated circuit devices.
Typical Properties
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2 g/cm3, Test Method ASTM D374
- Viscosity
- 222
- Liner Color
- N/A
- Drying Type
- Fast
- Format
- Paste
- Stencil Printable
Thermal Properties
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- CPU
- GPU
- Thin Bondline
- Key Features
- High Reliability
- Sub-segment
- AI/HPC
- Industry
- Technology and Telecommunications
Other
- Other Notes
- Stencil printable (SP) available in 300cc syringes or 1kg jars
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2 g/cm3, Test Method ASTM D374
- Viscosity
- 222
- Liner Color
- N/A
- Drying Type
- Fast
- Format
- Paste
- Stencil Printable
Thermal Properties
- Thermal Conductivity
- 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- CPU
- GPU
- Thin Bondline
- Key Features
- High Reliability
- Sub-segment
- AI/HPC
- Industry
- Technology and Telecommunications
Other
- Other Notes
- Stencil printable (SP) available in 300cc syringes or 1kg jars
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 4.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.06-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 2 g/cm3, Test Method ASTM D374
- Liner Color : N/A
- Drying Type : Fast
- Shelf Life : 12 months
- Viscosity : 222
- Format : Paste|Stencil Printable
- Key Features : High Reliability
- Sub-segment : AI/HPC
- Application : CPU|GPU|Thin Bondline
- Industry : Technology and Telecommunications
- Other Notes : Stencil printable (SP) available in 300cc syringes or 1kg jars
Application Note
Name
Description
File Size
Date
Size
Brochure
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Data Sheet
Name
Description
File Size
Date
Size
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Case Study
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
5.99 MB
9/16/2026
Data Sheet
70.68 KB
9/17/2026
Case Study
909.42 KB
9/18/2026
