PTM7950

AI CHIPS RUN HOT.
YOUR TIM CAN'T FALL BEHIND.

Higher clock speeds. Massive parallelism. Extreme heat flux. AI hardware leaves no room for thermal compromise. Traditional TIMS pump out, dry out, and drift. Solstice PTM7950 Phase Change Material (PCM) is built for sustained performance, delivering:

• Ultra-low thermal resistance at the interface
• Superior wetting at operating temperature
• Reliable heat transfer from chip to sink
• Long service life under thermal cycling

Based on a novel polymer PCM system, this proprietary material provides superior reliability (pass 150˚C baking 1000 hours, T/C-B 1000 cycles) and maintains low thermal impedance (<0.04˚Ccm2/W @ no shim), making the PTM7950 series desirable for high performance integrated circuit devices.

We invite you to evaluate PTM7950 for your applications, including:

• Power modules/inverters in automotive and power applications
• High-performance IT/enterprise computing devices
• Consumer electronics, high-performance IC
• High power LED

Available formats: 

• PTM7950 Pad | Easy application and no drying steps
• PTM7950-SPS | Paste version with slow-drying solvent
• PTM7950-SP | Paste version for automatic stencil printing

Key Features

• High performance filler and polymer technology
• Silicone-free, no pump out, bleed out, dry out issues
• Highly conductive filler loading to optimize performance
• Industry-proven superior long-term reliability 
• Min BLT~20um, typical BLT is below 50um 
• 30~40 psi pressure is needed for usage

Achieving thin bondline and great thermal performance by minimum pressure application
One of the key characteristics of PTM7950 is its bondline thickness, which refers to the thickness of the layer of adhesive between two surfaces being bonded. Please refer to the chart - PTM7950 Bondline Thickness vs. Pressure in the thumbnail to learn more about changes in PTM7950 BLT (mm) under varying pressure conditions (psi).

As the pressure applied to PTM7950 increases, the bondline thickness decreases. Specifically, a minimum pressure of 10 psi is needed to observe a significant reduction in bondline thickness. This means that lower pressure is sufficient to achieve a thinner bondline, which can be advantageous in certain applications.

PTM7950 is best-in-class against other thermal materials

Refer to chart - Solstice PTM7950: Comparison of thermal performance (click on the thumbnails to enlarge), where thermal impedance values for various materials is shown, including that of PTM7950 and PTM7900.  Both of these materials have the lowest thermal impedance values when compared to all other materials tested, including competitive thermal greases. Overall, the PTM 7950 is the top performer among all materials tested for thermal impedance.

The PTM 7950 is clearly the best choice for thermal impedance, with the lowest value among all materials tested. This makes it an excellent option for electronic devices that require exceptional thermal management.

Get in touch with our experts to learn more.