Thermal Two-Part Hybrids
HLT7000
Solstice HLT series products are two-component cured-in-place dispensable gap fillers could be easily dispensed w/good thixotropic characteristics and low viscosity, provides the high compressibility and excellent long term reliability. (7.0 W/m·K)
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Overview
Two-Part, Dispensable, Very Low Compression Force HLT series products are two-component, dispensable thermally conductive gels, which offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage. Prior to curing, the material maintains good thixotropic characteristics and low viscosity to be easily dispensed.
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Memory & power modules
Features
• Low contact resistance
• Easily to dispense and rework
• High compressibility for low stress applications
• Long-term reliability
• Reduced oil separation
• No pump-out and cracking
Typical Applications
• Consumer electronics
• Telecommunications equipment
• Automotive electronics
• Memory & power modules
Features
• Low contact resistance
• Easily to dispense and rework
• High compressibility for low stress applications
• Long-term reliability
• Reduced oil separation
• No pump-out and cracking
Typical Properties
Physical Properties
- Hardness
- 50 Shore00, Test Method ASTM D2240
- Shelf Life
- 6 months
- Format
- Gel
Thermal Properties
- Thermal Conductivity
- 7.0 W/m-K, Test Method ASTM D5470
General Information
- Application
- Automation
- CPU
- GPU
- Gap Filler
- Memory
- Power Device
- Key Features
- Easy to Dispense
- High Reliability
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Sub-segment
- ADAS
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Physical Properties
- Hardness
- 50 Shore00, Test Method ASTM D2240
- Shelf Life
- 6 months
- Format
- Gel
Thermal Properties
- Thermal Conductivity
- 7.0 W/m-K, Test Method ASTM D5470
General Information
- Application
- Automation
- CPU
- GPU
- Gap Filler
- Memory
- Power Device
- Key Features
- Easy to Dispense
- High Reliability
- Typical Uses
- Consumer electronics
- Memory & power modules
- Telecommunications equipment
- Sub-segment
- ADAS
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
- Format : Gel
- Thermal Conductivity : 7.0 W/m-K, Test Method ASTM D5470
- Shelf Life : 6 months
- Hardness : 50 Shore00, Test Method ASTM D2240
- Typical Uses : Consumer electronics|Memory & power modules|Telecommunications equipment
- Key Features : Easy to Dispense|High Reliability
- Sub-segment : ADAS
- Application : Automation|CPU|GPU|Gap Filler|Memory|Power Device
- Industry : Automotive|Consumer Electronics|Technology and Telecommunications
Application Note
Name
Description
File Size
Date
Size
Brochure
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Data Sheet
Name
Description
File Size
Date
Size
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Case Study
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
5.99 MB
9/16/2026
Data Sheet
70.68 KB
9/17/2026
Case Study
909.42 KB
9/18/2026
