Semiconductor Materials
Providing critical materials that enhance performance and productivity of your electronics manufacturing processes.
Solstice Advanced Materials is one of the leading suppliers of innovative products serving the critical needs of the semiconductor industry. Every year we expand our product lines, including materials for almost every stage of wafer fabrication and semiconductor packaging applications.
Solstice’s extensive range of Thermal Interface Materials (TIMs) for packaging and assembly applications combine advanced formulation technology with robust performance characteristics, addressing the pressing heat management challenges faced in today’s high-functioning electronics landscape.
Thermal Interface Materials (TIMs) are essential components in modern electronics, enabling efficient heat transfer between surfaces that need to manage thermal loads effectively. As devices become increasingly compact and powerful, the demand for reliable TIMs has grown significantly. These materials play a crucial role in applications ranging from semiconductor packaging to consumer electronics and automotive systems.
WHY THERMAL INTERFACE MATERIALS MATTER
By acting as gap fillers between mating surfaces—like semiconductor devices and heat sinks—Thermal Interface Materials (TIMs) minimize thermal resistance, thereby enhancing the overall thermal management of the system.
Despite the appearance of flat surfaces, microscopic irregularities such as pores and tool marks create tiny air gaps that insulate against heat transfer. Thermal Interface Materials (TIMs) are designed to bridge these gaps with materials that exhibit much higher thermal conductivity, often surpassing air by nearly 100 times. This ensures that heat is dissipated effectively, which is critical for extending the operational lifespan and reliability of electronic components.
Solstice Thermal Interface Material (TIM) Offerings
Solstice Thermal Interface Material (TIM) Offerings Include:
A Phase Change Material (PCM) is a polymer-filler composition that softens to wet the die/sink surfaces at an optimum temperature and enables efficient heat transfer. It is applied between a bare flip chip die and a heat spreader, heat sink, or heat pipe and is, therefore, referred to as Thermal Interface Material (TIM) 1.5.
Applying Phase Change TIM helps in:
- Optimizing thermal conductivity by reducing interface contact resistance and allowing heat to move more freely and efficiently from the chip to the heat sink.
- Improving reliability by reducing the likelihood of thermal-induced deformation
- Simplifying the assembly process
Solstice offers a range of phase change TIMs which offer a wide range of thermal properties. Furthermore, each of these products are available in different forms, such as pads, sheets, screen printable and dispensable pastes to fit the multiple assembly needs.
The choice of Phase Change Material (PCM) is largely dictated by the application, namely the power density of the device, the bond line thickness, and the thermal performance needed for a safe and reliable operation.
THERMAL TWO-PART HYBRIDS
The Thermal Two-Part Hybrids products are two-component, dispensable thermally conductive gels that offer long-term reliability and superior softness. The enhanced bonding force between the polymer base and the filler minimizes oil separation issues in storage.
Thermal hybrid gels require very low compression force and can be used for vertical mounting. Before curing, the materials maintain good thixotropic characteristics and low viscosity to be easily dispensed. Additionally, they show minimal post-cure oil bleeding/separation and no pump-out or cracking.
Two component hybrid thermal gels can be cured in a short time after two-component mixing at room temperature. HLT series thermal gels require curing but very little pressure during installation (5-10psi or the weight of a heatsink is sufficient). You can speed up the process by curing at elevated temperatures (80 -100°C). The high compressibility minimizes thermal resistance at interfaces, making hybrids ideal for low stress applications while maintaining excellent performance during reliability testing.
THERMAL GAP PADS
Solstice Thermal Gap Filler Pads (TGP) are designed for thick bond line applications with large variances in gap dimensions between heat sources and heat sinks. Where the heat source is comprised of multiple microprocessors soldered onto a printed circuit board, the gap filler pads need to fill spaces between the chips and the heat sink.
In the consumer electronics industry, Thermal Gap Pads must be simultaneously soft, elastic and thermally conductive. For manufacturers operating at the current technological level, a balance must be struck between high rebound resilience and low hardness. Solstice Thermal Gap Pads provide exceptional thermal conductivity, exert limited pressure onto the chip and PCB to avoid damage, and ensure the rebound necessary to enable sustainable surface contact – all while minimizing outgassing and oil bleeding to maintain long-term device reliability.
Solstice Phase Change Materials (PCM) and Hybrid Gels stand out as the ideal solution for EV manufacturers to effectively dissipate heat, ensuring that vehicles remain efficient, reliable, and ready for the demands of modern driving. By choosing Solstice, you gain a competitive edge through superior thermal management for inverter, onboard charger (OBC) and advanced driver assistance systems (ADAS).
ELECTRIC VEHICLES
After professional reliability testing in the new energy automobile industry, Solstice Phase Change Material has successfully passed various rigorous tests such as high- and low-temperature cycles, high- and low-temperature shocks, long-term high-temperature baking, power cycles, HAST, vibration, shock, dripping test, etc.
Solstice tightly wraps the fillers and substrates by carefully designing the molecular structure and applying multi-chain fillers to further enhance stability and long-term reliability.
The following thermal management solutions are designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. Solstice thermal solutions offer stable thermal impedance across accelerated aging tests and do not display bleeding, pumping, or flow out.
| Segment | Inverter | DC/DC Converter | On-board Charger | ECU | ADAS |
| Applications | IGBT Module | Power Module | Power Module | Lighting Device | GPU/CPU/Memory/Power Device |
| Products | PCMs - PTM7000 - PTM7000SPM |
Thermal Insulator - TIP5000 - TIP3500 Thermal Grease - TG5500 |
PCMs - PTM7000SPM - PTM6000SPM |
Two-part Thermally Conductive Gel - HLT7000 - HLT2000 Thermal Grease - TG3010 |
PCMs - PTM7900 - PTM7000 Two-part Thermally Conductive Gel - HLT10000 - HLT8000 - HLT7000 |
CONSUMER ELECTRONICS
Cutting-edge thermal management solutions play a vital role in enhancing the performance and longevity of consumer electronics by:
- Efficiently absorbing and releasing heat during their phase transitions, mitigating temperature spikes generated by compact, high-performance devices like smartphones and tablets. This ability to manage thermal loads improves energy efficiency and allows for slimmer designs, eliminating the need for bulky cooling systems like fans.
- Providing effective heat transfer by bridging air gaps between components, supporting both heat dissipation and mechanical stability in densely packed electronics.
- Offering superior thermal conductivity and low thermal resistance, adapting well to tight spaces and irregular surfaces, thereby enhancing reliability.
| Segment | Notebook/ Tablet/PC | Gaming Console | Projector | Camera/GPS |
| Applications | GPU/CPU | GPU/CPU | Laser | CPU/Memory |
| Products | PCMs - PTM7950 - PTM7950SP - PTM7900 - PTM7900SP Two-part Thermally Conductive Gel - HLT3500 |
PCM - PTM5000 |
PCMs - PTM7900 - PTM7950SP |
Thermal Gap Pads - TGP6000PT - TGP3500PT Two-part Thermally Conductive Gel - HLT3500 |
HPC, DATA CENTERS AND TELECOM EQUIPMENT
In high-performance computing (HPC) and data centers leveraging AI chips, advanced thermal management solutions such as Phase Change Material (PCM) and Thermal Gap Pads are essential for ensuring efficient operation and reliability. Phase Change Material (PCM) act by absorbing thermal fluctuations during peak AI processing loads, reducing the demand for active cooling and lowering energy costs.
The Gap pads effectively transfer heat in densely packed server architectures, ensuring that critical components remain stable and perform optimally under high thermal loads. Both these materials provide exceptional thermal contact, adapting to variable power loads typical of AI workloads, while maintaining long-term reliability. Overall, Phase Change Materials (PCMs) and Gap Pads maximize AI chip efficiency and scalability and help mitigate risks associated with overheating, ensuring improved uptime and reduced operational costs.
| Segment | Server | AI/HPC | Networks |
| Applications | GPU/CPU/Memory | GPU/CPU | Base Station/Optical Transceiver/Switch |
| Products | PCM - PTM7900 Thermal Gap Pad - TGP8000PT - TGP6000PT - TGP3500PT |
PCMs - PTM7950 - PTM7900 - PTM6880 - PTM6000 |
PCMs - PTM7950 - PTM7900 - PTM7000 |
Ready to Connect?
As you explore the benefits of Solstice TIMs, we invite you to evaluate these for your specific application needs. Our team of experts will assist you in testing and integrating our solution into your application.
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Solstice Semiconductor Materials
We are one of the leading semiconductor materials suppliers for the semiconductor industry. Every year we expand our product lines, including materials for almost every stage of wafer fabrication and semiconductor packaging.
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Solstice Advanced Materials Inc.
115 Tabor Rd.
Morris Plains, NJ 07950