Semiconductor Materials
Providing critical materials that enhance performance and productivity of your electronics manufacturing processes.
Thermal Interface Materials (TIMs) are essential components in modern electronics, enabling efficient heat transfer between surfaces that need to manage thermal loads effectively. As devices become increasingly compact and powerful, the demand for reliable TIMs has grown significantly. These materials play a crucial role in applications ranging from semiconductor packaging to consumer electronics and automotive systems.
Why is a Thermal Interface Material (TIM) crucial for modern electronic devices?
By acting as gap fillers between mating surfaces—like semiconductor devices and heat sinks—Thermal Interface Materials (TIMs) minimize thermal resistance, thereby enhancing the overall thermal management of the system.
Despite the appearance of flat surfaces, microscopic irregularities such as pores and tool marks create tiny air gaps that insulate against heat transfer. Thermal Interface Materials are designed to bridge these gaps with materials that exhibit much higher thermal conductivity, often surpassing air by nearly 100 times. This ensures that heat is dissipated effectively, which is critical for extending the operational lifespan and reliability of electronic components.
Solstice Advanced Materials Thermal Interface Material (TIM) Offerings
Solstice’s extensive range of Thermal Interface Materials (TIMs) combines advanced formulation technology with robust performance characteristics, addressing the pressing heat management challenges faced in today’s high-functioning electronics landscape. Solstice’s Thermal Interface Material (TIM) offerings include:
FEATURED PRODUCT
PTM7950 is a highly thermally conductive Phase Change Material (PCM) designed to minimize thermal resistance at interfaces, maintain excellent performance through reliability testing, and provide scalable applications at a competitive cost. Based on a novel polymer PCM system, PTM7950 exhibits excellent interface wettability during typical operating temperature ranges, resulting in extremely low surface contact resistance.
The PTM7950 is clearly the best choice for thermal impedance, with the lowest value among all materials tested. This makes it an excellent option for electronic devices that require exceptional thermal management.
AVAILABLE VERSIONS:
PTM7950 Pad: Easy application and no drying steps
PTM7950-SP: Paste version for automatic stencil printing
PTM7950-SPS: Paste version with slow-drying solvent
FEATURED PRODUCT
HLT10000 High TC Hybrid Thermal Interface Material (TIM) has a thermal conductivity of 10 W/mK, high reliability, and ease of dispensing. It can be cured after two-component mixing and faster under higher temperatures. Its high compressibility minimizes interface thermal resistance while maintaining excellent performance during reliability testing.
This product is engineered for the most demanding and delicate applications on the market. It starts with a very low thickness and compresses just as easily, reaching its final thickness at a remarkable rate. It is also easy to dispense and rework, making it ideal for high volume manufacturing. To add to that, it offers reduced oil separation and doesn't exhibit pump out or cracking.
Featured Products
Solstice HGP10000 thermal gap pad provides high thermal performance with ease of use across multitude of applications. Its ultra-high compressibility enables low stress and excellent conformity to mating surfaces. It is designed to minimize thermal resistance at interfaces and maintain excellent performance through reliability testing.
Key Features
10 W/m·K thermal conductivity
Ultra-high compressibility for low stress applications
High residual stress after relaxation
Excellent surface wetting for low contact resistance
High reliability
Electrically insulating
Available in thickness range from 1mm to 5.0mm with 0.25mm incremental
HGP14 High Thermal Conductivity Gap Pad
HGP14 is a high-performance thermal interface material designed for efficient heat transfer in demanding electronic applications. It offers a thermal conductivity of 14.0 W/m·K, making it well-suited for systems requiring high thermal dissipation across varying bond line thicknesses. The material is soft and conformable, allowing it to fill gaps between components and heat sinks without introducing significant mechanical stress. This makes it suitable for use with fragile components or assemblies where minimizing stress during installation is critical.
HGP14 also maintains material integrity over time, with low volatility and minimal oil bleed, reducing the risk of contamination or pump-out under thermal cycling. Its stability makes it a strong choice for applications sensitive to oil migration or where long-term performance is required. Solstice HGP14 is well-suited for high-power electronics, automotive systems, and telecommunications equipment, where superior heat dissipation and long-term stability are essential.
| Segment | Inverter | DC/DC Converter | On-board Charger | ECU | ADAS |
| Applications | IGBT Module | Power Module | Power Module | Lighting Device | GPU/CPU/Memory/Power Device |
| Products | PCMs - PTM7000 - PTM7000SPM |
Thermal Insulator - TIP5000 - TIP3500 Thermal Grease - TG5500 |
PCMs - PTM7000SPM - PTM6000SPM |
Two-part Thermally Conductive Gel - HLT7000 - HLT2000 Thermal Grease - TG3010 |
PCMs - PTM7900 - PTM7000 Two-part Thermally Conductive Gel - HLT10000 - HLT8000 - HLT7000 |
Download the product guide for information on thermal, physical, and electrical properties.
| Segment | Notebook/ Tablet/PC | Gaming Console | Projector | Camera/GPS |
| Applications | GPU/CPU | GPU/CPU | Laser | CPU/Memory |
| Products | PCMs - PTM7950 - PTM7950SP - PTM7900 - PTM7900SP Two-part Thermally Conductive Gel - HLT3500 |
PCM - PTM5000 |
PCMs - PTM7900 - PTM7950SP |
Thermal Gap Pads - TGP6000PT - TGP3500PT Two-part Thermally Conductive Gel - HLT3500 |
Download the product guide for information on thermal, physical, and electrical properties.
| Segment | Server | AI/HPC | Networks |
| Applications | GPU/CPU/Memory | GPU/CPU | Base Station/Optical Transceiver/Switch |
| Products | PCM - PTM7900 Thermal Gap Pad - TGP8000PT - TGP6000PT - TGP3500PT |
PCMs - PTM7950 - PTM7900 - PTM6880 - PTM6000 |
PCMs - PTM7950 - PTM7900 - PTM7000 |
Download the product guide for information on thermal, physical, and electrical properties.
Ready to Connect?
As you explore the benefits of Solstice TIMs, we invite you to evaluate these for your specific application needs. Our team of experts will assist you in testing and integrating our solution into your application.
Products
Solstice Semiconductor Materials
We are one of the leading semiconductor materials suppliers for the semiconductor industry. Every year we expand our product lines, including materials for almost every stage of wafer fabrication and semiconductor packaging.
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Solstice Advanced Materials Inc.
115 Tabor Rd,
Morris Plains, NJ 07950