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Automotive ADAS system-on-chip on a circuit board

ADAS Thermal Management

Unlock peak ADAS performance with Solstice TIMs

As a strategic thermal partner for EV applications, Solstice provides high-performance, automotive-grade thermal management from chip-level to system-level integration. We help our customers reduce junction temperatures in next generation chips while upholding the highest standards of reliability and manufacturability.

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Thermal management in ADAS is a real challenge as they are subjected to rapid temperature swings, constant vibration, and must meet zero-defect automotive reliability expectations. This harsh environment puts tremendous stress on conventional thermal interface materials. Without a robust thermal strategy, systems can experience rising junction temperatures, degraded compute performance, early aging, or even catastrophic failures.

That’s exactly where Solstice Advanced Materials delivers a next-generation solution. From chip to enclosure, we turn heat into a controlled pathway, not a risk.

The Architecture

Solstice Advanced ADAS Thermal Architecture for Next-Generation EV Platforms

For over half a century, Solstice has been a key supplier of semiconductor materials to the worldwide electronics industry. Our product portfolio is designed to enhance the performance and reliability of your products and includes materials for almost every stage of fabrication and packaging applications.

Solstice delivers a tailored solution, engineered specifically for next-generation vehicle-level ADAS compute platforms. This integrated solution combines three robust components to systematically address localized hotspots and enhance the effective dissipation area.

1
On the Bare Die · TIM1.5

High-Performance Phase Change Material (PTM Series, TIM1.5)

Applied directly on the bare die, Solstice’s PCM offers:

  • Thin bond line for minimal thermal resistance
  • Exceptional mechanical compliance
  • Strong resistance to pump-out and degradation
  • High reliability under extreme thermal cycling
2
System Heat Spreader

Customized Heat Spreader

Solstice Heat Spreader is designed to maximize heat spreading across the thermal stack and ensure uniform surface contact.

  • Optimized material selection: Evaluate high-thermal-conductivity materials aligned with customer requirements for reliability, weight, and coefficient of thermal expansion (CTE).
  • System-level thermal integration: Co-design the heat spreader as an integral part of the overall cooling architecture — including cold plates, liquid cooling, or air cooling — to minimize total thermal resistance.
  • Performance-to-weight optimization: Balance heat-spreading efficiency, thickness, and mass to meet customer’s packaging constraints and vehicle efficiency targets.
  • Manufacturable and scalable design: Enhance compatibility with high-volume automotive manufacturing processes, supporting cost, quality, and supply-chain scalability.
  • Reliability and platform scalability: Work closely with customers to validate durability under automotive thermal cycling, vibration, and mechanical stress conditions, while enabling reuse across future vehicle platforms.
3
To the Cold Plate · TIM2

High Conformability Gel TIM2

Placed between the heat spreader and the cold plate, this Solstice gel ensures:

  • Low contact resistance
  • Excellent wetting to interfaces
  • Long-term stability under vibration and load cycling
  • Room temperature cure or fast cure under heating
  • Low assembly stress
  • High thixotropy

Solution Value

Lower junction temperature directly translates to:

  • Higher sustained compute performance
  • Longer component lifetime
  • Reduced risk of thermal throttling
  • Fewer system-level failures

 

This integrated solution has been validated through our in-house Thermal Test Vehicle, where the Solstice PCM delivered a significant reduction in junction temperature compared to stacks without PCM.

Automotive-Grade Reliability You Can Trust

Solstice’s portfolio is built for the toughest automotive conditions: extreme heat, rapid cycling, high humidity, vibration, shock, and chemical exposure. The flagship Solstice PTM 7900 material passes every major AEC-Q qualification category, including thermal shock, humidity, storage stability, mechanical stress, and corrosive gas exposure.

This makes Solstice’s materials ideal for:

Autonomous domain controllers

Centralized vehicle compute

High-power ADAS processors

In-cabin and under-hood digital control units

With ADAS platforms expected to operate flawlessly for 10–15 years, Solstice ensures components stay cool, stable, and reliable over the full vehicle lifetime.

Designed for the Future of High-Power Automotive Electronics

Solstice offers one of the industry’s most comprehensive ranges of thermal materials – covering thin bond line PCMs, gel TIMs, gap pads, and hybrid fillers tailored for diverse ADAS and EV power densities.

Solstice thermal material portfolio mapped to application power density, from PCM thin bond line solutions to gap pads and hybrid gap fillers across ADAS, on-board charger, and inverter automotive electronics.

Solstice thermal material portfolio mapped to application power density — from PCM thin BLT solutions to gap pads and hybrid gap fillers across ADAS and EV automotive electronics.

Solstice has a ready-to-deploy solution whether your design requires:

Thin thermal interface

Compliance for larger tolerances

Materials compatible with automated production

Proven reliability in severe environments

Power the Next Generation of ADAS with Solstice

As vehicles evolve into high-performance computers on wheels, thermal management is becoming a core enabler of safety, speed, and intelligence. Solstice is committed to helping OEMs and Tier 1s build smarter, safer, more reliable autonomous systems – starting at the material level.

If your team is exploring new ADAS designs or facing challenging thermal bottlenecks, Solstice’s specialists are ready to help engineer the right solution. Solstice delivers advanced thermal materials that enable high-performance ADAS systems to operate reliably in constricted, high-temperature environments, optimizing heat transfer, minimizing thermal resistance, and protecting critical compute and sensing functions.

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