Thermal Gap Filler Pads
TGP8000
Exhibits low oil bleeding and outgassing along with low hardness. Naturally tacky, and requires no additional adhesive which could inhibit thermal performance. (Grey color, 0.2 Thermal Impedance, 8.0 Thermal Conductivity, Hardness 30 on Shore 00)
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Overview
Solstice Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Solstice TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.Typical Applications• Consumer electronics• Telecommunications & network servers• Automotive electronics• Power devices & modules• Semiconductor logic & memoryFeatures• High thermal performance• Ultra-high compressibility for low stress applications• Excellent surface wetting for low contact resistance• High reliability• Electrically insulating
Specifications
Physical Properties
- Color
- Grey
- Hardness
- 30 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.4, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.20 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 8.3 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 6.47x1015 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- Gap Filler
- High Compressibility
- Key Features
- Low Hardness
- Low Oil Bleeding
- Low Outgassing
- Industry
- Automotive
- Consumer Electronics
- Energy
- Technology and Telecommunications
Physical Properties
- Color
- Grey
- Hardness
- 30 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months Year
- Specific Gravity
- 3.4, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.20 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 8.3 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 6.47x1015 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- Gap Filler
- High Compressibility
- Key Features
- Low Hardness
- Low Oil Bleeding
- Low Outgassing
- Industry
- Automotive
- Consumer Electronics
- Energy
- Technology and Telecommunications
- Color : Grey
- Thermal Conductivity : 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.20 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Specific Gravity : 3.4, Test Method ASTM D792
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Shelf Life : 12 months Year
- Hardness : 30 Shore00, Test Method ASTM D2240
- Format : Pad
- Dielectric Constant : 8.3 @ 1MHz, Test Method ASTM D150
- Volume Resistivity : 6.47x1015 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Key Features : Low Hardness|Low Oil Bleeding|Low Outgassing
- Application : Gap Filler|High Compressibility
- Industry : Automotive|Consumer Electronics|Energy|Technology and Telecommunications
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Data Sheet
Name
Description
File Size
Date
Size
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
