Phase Change Materials
PCM45F
PCM45F is a Phase Change Pad with a Thermal Impedance of 0.09 – 0.12 (°C cm²/w), Thermal Conductivity of 2 (w/mk) and Specific Gravity of 2.2 (g/cm³).
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Overview
PCM45F is Solstice's thermally conductive phase change pad. It is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing for long product life applications. In addition, it has excellent electrical properties and very high-volume resistivity.
PCM45F has a Thermal conductivity of 2.0 - 2.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.09-0.12), making it desirable for high-performance integrated circuit devices.
PCM45F has a Thermal conductivity of 2.0 - 2.5 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. The proprietary material provides superior reliability and maintains low thermal impedance (0.09-0.12), making it desirable for high-performance integrated circuit devices.
Typical Properties
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.2 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
- Viscosity
- N/A
- Liner Color
- Pink
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 2.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 8.2x1014 ohm-cm, Test Method ASTM D258
General Information
- Application
- Base Station
- Optical
- Switch
- Thin Bondline
- Transceiver
- Key Features
- High Reliability
- Typical Uses
- Action Cameras
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Router
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Smartphones
- Sub-segment
- Camera
- Networks
- Notebook
- Tablet
- Industry
- Technology and Telecommunications
Other
- Other Notes
- Pads available in sheets and rolls
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.2 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.20-1.00
- Viscosity
- N/A
- Liner Color
- Pink
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 2.4 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
Electrical Properties
- Volume Resistivity
- 8.2x1014 ohm-cm, Test Method ASTM D258
General Information
- Application
- Base Station
- Optical
- Switch
- Thin Bondline
- Transceiver
- Key Features
- High Reliability
- Typical Uses
- Action Cameras
- IGBT
- Lighting
- Power control unit, inverter, onboard electronics
- Router
- Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)
- Smartphones
- Sub-segment
- Camera
- Networks
- Notebook
- Tablet
- Industry
- Technology and Telecommunications
Other
- Other Notes
- Pads available in sheets and rolls
- Viscosity : N/A
- Thickness (mm) : 0.20-1.00
- Thermal Impedance : 0.09-0.12 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Thermal Conductivity : 2.4 W/m-K, Test Method ASTM D5470
- Specific Gravity : 2.2 g/cm3, Test Method ASTM D374
- Shelf Life : 12 months
- Liner Color : Pink
- Format : Pad
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Volume Resistivity : 8.2x1014 ohm-cm, Test Method ASTM D258
- Application : Base Station|Optical|Switch|Thin Bondline|Transceiver
- Typical Uses : Action Cameras|IGBT|Lighting|Power control unit, inverter, onboard electronics|Router|Servers, supercomputing, video graphic array (VGA) cards, AI, GPU/CPU/Desktop, solid state drives (SSD)|Smartphones
- Sub-segment : Camera|Networks|Notebook|Tablet
- Key Features : High Reliability
- Industry : Technology and Telecommunications
- Other Notes : Pads available in sheets and rolls
Application Note
Name
Description
File Size
Date
Size
Brochure
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Data Sheet
Name
Description
File Size
Date
Size
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Data Sheet
application/pdf 197.9 KB
10/6/2026
197.9 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Case Study
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Data Sheet
application/pdf 197.9 KB
10/6/2026
197.9 KB
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
5.99 MB
9/16/2026
Data Sheet
70.68 KB
9/17/2026
Case Study
909.42 KB
9/18/2026
