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Phase Change Materials

PTM6880

PTM6880 is a Phase Change Pad, Sheet and Paste with a Thermal Impedance of 0.056 (°C cm²/w), Thermal Conductivity of 6 (w/mk) and Specific Gravity of 2.7 (g/cm³)

Overview
PTM6880 makes pump-out a thing of the past

Solstice is proud to introduce PTM6880, an advanced PCM that provides superior reliability, and maintains low thermal impedance (<0.06˚C.cm2/W@ no shim), making it an ideal choice for high-performance integrated circuit (HPC) devices.

Pump-out issues lead to poor performance of the devices
Pump-out issues with thermal interface materials (TIMs) pose a challenge because they disrupt the efficient transfer of heat between components, potentially leading to overheating and component failure. This phenomenon occurs when the TIM is forced out of the interface gap, creating air voids that act as thermal insulators. This can happen due to thermal expansion and contraction of the interface surfaces, especially with rapid temperature changes.

Addressing these challenges requires an innovative approach to thermal design to ensure efficient cooling in HPCs.

Introducing PTM6880 - a next-generation PCM, engineered to:
  • Improve thermal resistance against pump out/vertical flow at interfaces: PTM6880 provides a reliable solution by maintaining consistent flatness between the chip and heatsink, even in tight applications needing less than 0.1mm tolerance.
  • Provide better hotspot distribution: PTM6880 effectively spread heat away from localized high-temperature areas on electronic components to help prevent thermal failure, enhance device performance, and extend the lifespan of electronic devices.
  • Maintain stable thermal performance required for longer product life applications: With PTM6880, you can achieve efficient heat dissipation, ensuring optimal performance for your chips while minimizing the risks associated with overheating.
  • Enhance production efficiency: PTM6880 is instrumental in streamlining automated processes while drastically reducing the risk of damage to the bare die. It also decreases the need for rework and repairs, making it the ideal choice for modern high-performance applications.
Based on a novel polymer PCM system, this material exhibits excellent interface wettability during typical operating temperature ranges, resulting in the low surface contact resistance especially for small level range gap applications, including:
  • AI Servers GPU/CPU, Supercomputing
  • EV Inverter, onboard charger (OBC), DC/DC converters
  • Switches, routers, base stations
  • IGBT Power Module
The product has been extensively tested and validated for its superior thermal resistance and excellent heat distribution capabilities.

Connect with us

Unlock the full potential of your next-generation devices with Solstice PTM6880. This advanced PCM has what you need to gain an edge in performance. Contact us today to evaluate PTM6880 for your applications and to discover how this advanced PCM can transform your device’s performance.
Typical Properties

Physical Properties

  • Bond-Line Thickness (BLT)
    • 20μm
  • Color
    • Grey
  • Shelf Life
    • 12 months
  • Specific Gravity
    • 2.7 g/cm3, Test Method ASTM D374
  • Viscosity
    • Unit Pa·s @2 101/s, 25˚C
  • Format
    • Pad
    • Paste

Thermal Properties

  • Thermal Conductivity
    • 6 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 0.056 °C cm²/W, Test Method ASTM D5470 Modified

Electrical Properties

  • Volume Resistivity
    • 2.1x1014 ohm·cm

General Information

  • Application
    • Base Station
    • CPU
    • GPU
    • IGBT Module
    • Power Module
    • Switch
    • Thin Bondline
  • Key Features
    • High Reliability
  • Typical Uses
    • Router
  • Sub-segment
    • AI/HPC
    • DC/DC Converter
    • Inverter
    • On-Board Charger
    • Server
  • Industry
    • Automotive
    • Energy
    • Technology and Telecommunications

Other

  • Other Notes
    • Pads available in sheets and rolls

Physical Properties

  • Bond-Line Thickness (BLT)
    • 20μm
  • Color
    • Grey
  • Shelf Life
    • 12 months
  • Specific Gravity
    • 2.7 g/cm3, Test Method ASTM D374
  • Viscosity
    • Unit Pa·s @2 101/s, 25˚C
  • Format
    • Pad
    • Paste

Thermal Properties

  • Thermal Conductivity
    • 6 W/m-K, Test Method ASTM D5470
  • Thermal Impedance
    • 0.056 °C cm²/W, Test Method ASTM D5470 Modified

Electrical Properties

  • Volume Resistivity
    • 2.1x1014 ohm·cm

General Information

  • Application
    • Base Station
    • CPU
    • GPU
    • IGBT Module
    • Power Module
    • Switch
    • Thin Bondline
  • Key Features
    • High Reliability
  • Typical Uses
    • Router
  • Sub-segment
    • AI/HPC
    • DC/DC Converter
    • Inverter
    • On-Board Charger
    • Server
  • Industry
    • Automotive
    • Energy
    • Technology and Telecommunications

Other

  • Other Notes
    • Pads available in sheets and rolls
  • Viscosity : Unit Pa·s @2 101/s, 25˚C
  • Thermal Impedance : 0.056 °C cm²/W, Test Method ASTM D5470 Modified
  • Thermal Conductivity : 6 W/m-K, Test Method ASTM D5470
  • Specific Gravity : 2.7 g/cm3, Test Method ASTM D374
  • Shelf Life : 12 months
  • Format : Pad|Paste
  • Color : Grey
  • Bond-Line Thickness (BLT) : 20μm
  • Volume Resistivity : 2.1x1014 ohm·cm
  • Application : Base Station|CPU|GPU|IGBT Module|Power Module|Switch|Thin Bondline
  • Typical Uses : Router
  • Sub-segment : AI/HPC|DC/DC Converter|Inverter|On-Board Charger|Server
  • Key Features : High Reliability
  • Industry : Automotive|Energy|Technology and Telecommunications
  • Other Notes : Pads available in sheets and rolls
Application Note
Name
Description
File Size
Date
Size
Application Note
application/pdf 2.23 MB
9/18/2026
2.23 MB
Brochure
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Data Sheet
Name
Description
File Size
Date
Size
Data Sheet
application/pdf 79.29 KB
9/17/2026
79.29 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 118.8 KB
9/17/2026
118.8 KB
Data Sheet
application/pdf 102.7 KB
9/17/2026
102.7 KB
Data Sheet
application/pdf 67.31 KB
9/17/2026
67.31 KB
Technical Data Sheet
application/pdf 283.64 KB
9/17/2026
283.64 KB
Data Sheet
application/pdf 157.65 KB
9/17/2026
157.65 KB
Data Sheet
application/pdf 104.71 KB
9/17/2026
104.71 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Technical Data Sheet
application/pdf 274.1 KB
9/17/2026
274.1 KB
Data Sheet
application/pdf 57.47 KB
9/17/2026
57.47 KB
Data Sheet
application/pdf 262.81 KB
9/17/2026
262.81 KB
Data Sheet
application/pdf 251.41 KB
9/17/2026
251.41 KB
Data Sheet
application/pdf 78.62 KB
9/17/2026
78.62 KB
Data Sheet
application/pdf 197.9 KB
10/6/2026
197.9 KB
Data Sheet
application/pdf 261.15 KB
9/16/2026
261.15 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Case Study
Name
Description
File Size
Date
Size
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Application Note
application/pdf 2.23 MB
9/18/2026
2.23 MB
Data Sheet
application/pdf 79.29 KB
9/17/2026
79.29 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 118.8 KB
9/17/2026
118.8 KB
Data Sheet
application/pdf 102.7 KB
9/17/2026
102.7 KB
Data Sheet
application/pdf 67.31 KB
9/17/2026
67.31 KB
Technical Data Sheet
application/pdf 283.64 KB
9/17/2026
283.64 KB
Data Sheet
application/pdf 157.65 KB
9/17/2026
157.65 KB
Data Sheet
application/pdf 104.71 KB
9/17/2026
104.71 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Technical Data Sheet
application/pdf 274.1 KB
9/17/2026
274.1 KB
Data Sheet
application/pdf 57.47 KB
9/17/2026
57.47 KB
Data Sheet
application/pdf 262.81 KB
9/17/2026
262.81 KB
Data Sheet
application/pdf 251.41 KB
9/17/2026
251.41 KB
Data Sheet
application/pdf 78.62 KB
9/17/2026
78.62 KB
Data Sheet
application/pdf 197.9 KB
10/6/2026
197.9 KB
Data Sheet
application/pdf 261.15 KB
9/16/2026
261.15 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Name
Description
File Size
Date
Size
Application Note
2.23 MB
9/18/2026
Brochure - Thermal Interface Materials (TIMs)
5.99 MB
9/16/2026
Data Sheet
79.29 KB
9/17/2026
Data Sheet
118.8 KB
9/17/2026
Data Sheet
102.7 KB
9/17/2026
Data Sheet
67.31 KB
9/17/2026
Technical Data Sheet
283.64 KB
9/17/2026
Data Sheet
157.65 KB
9/17/2026
Data Sheet
104.71 KB
9/17/2026
Technical Data Sheet
274.1 KB
9/17/2026
Data Sheet
57.47 KB
9/17/2026
Data Sheet
262.81 KB
9/17/2026
Data Sheet
251.41 KB
9/17/2026
Data Sheet
78.62 KB
9/17/2026
Data Sheet
197.9 KB
10/6/2026
Data Sheet
261.15 KB
9/16/2026
Phase Change Material Properties Chart
93.98 KB
9/16/2026