Phase Change Materials
PTM7900
PTM7900 is a Phase Change Pad with a Thermal Impedance of 0.04 - 0.08 (°C cm²/w), Thermal Conductivity of 8 (w/mk) and Specific Gravity of 2.8 (g/cm³)
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Overview
PTM7900 is designed to minimize thermal resistance at interfaces and maintain extremely stable performance through reliability testing required for long product life applications. It has stable thermal impedance across accelerated aging tests and does not display bleeding, pumping, or flow out.
PTM7900 has a Thermal conductivity of 8.0 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 - 0.08 OC cm2/w), making it desirable for high-performance integrated circuit devices. It has been qualified by major GPU and cooling solution manufacturers across the globe.
PTM7900 has a Thermal conductivity of 8.0 (W/m·K) depending on the bondline thickness. It is based on a robust polymer PCM structure that exhibits excellent wetting properties during typical operating temperature ranges, resulting in very low surface contact resistance. This proprietary material provides superior reliability and maintains low thermal impedance (0.04 - 0.08 OC cm2/w), making it desirable for high-performance integrated circuit devices. It has been qualified by major GPU and cooling solution manufacturers across the globe.
Typical Properties
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.8 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2
- 0.25
- 0.3
- 0.4
- 0.5
- Viscosity
- N/A
- Liner Color
- Light Blue
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- Base Station
- CPU
- GPU
- Laser
- Memory
- Optical
- Switch
- Thin Bondline
- Transceiver
- Key Features
- High Reliability
- Low TI
- Sub-segment
- Networks
- Notebook
- PC
- Projector
- Server
- Tablet
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Other
- Other Notes
- Pads available in sheets and rolls
Physical Properties
- Bond-Line Thickness (BLT)
- 0.038
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.8 g/cm3, Test Method ASTM D374
- Thickness (mm)
- 0.2
- 0.25
- 0.3
- 0.4
- 0.5
- Viscosity
- N/A
- Liner Color
- Light Blue
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
General Information
- Application
- Base Station
- CPU
- GPU
- Laser
- Memory
- Optical
- Switch
- Thin Bondline
- Transceiver
- Key Features
- High Reliability
- Low TI
- Sub-segment
- Networks
- Notebook
- PC
- Projector
- Server
- Tablet
- Industry
- Automotive
- Consumer Electronics
- Technology and Telecommunications
Other
- Other Notes
- Pads available in sheets and rolls
- Color : Grey
- Bond-Line Thickness (BLT) : 0.038
- Thermal Conductivity : 8.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.04-0.08 at no shim °C cm²/w, Test Method ASTM D5470 Modified
- Specific Gravity : 2.8 g/cm3, Test Method ASTM D374
- Thickness (mm) : 0.2|0.25|0.3|0.4|0.5
- Liner Color : Light Blue
- Shelf Life : 12 months
- Viscosity : N/A
- Format : Pad
- Key Features : High Reliability|Low TI
- Sub-segment : Networks|Notebook|PC|Projector|Server|Tablet
- Application : Base Station|CPU|GPU|Laser|Memory|Optical|Switch|Thin Bondline|Transceiver
- Industry : Automotive|Consumer Electronics|Technology and Telecommunications
- Other Notes : Pads available in sheets and rolls
Application Note
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
In Modern Electronic Devices
application/pdf 316.14 KB
8/7/2025
316.14 KB
Brochure
Name
Description
File Size
Date
Size
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
Data Sheet
Name
Description
File Size
Date
Size
Case Study
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Name
Description
File Size
Date
Size
For New Energy Vehicle Inverters
application/pdf 3.31 MB
6/12/2025
3.31 MB
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
application/pdf 900.68 KB
8/7/2025
900.68 KB
Thermal Interface Materials Electronics Brochure
application/pdf 821.77 KB
8/7/2025
821.77 KB
In Modern Electronic Devices
application/pdf 316.14 KB
8/7/2025
316.14 KB
Name
Description
File Size
Date
Size
Enhancing Performance and Reliability with TIM 1.5 Thermal Solutions
900.68 KB
8/7/2025
Thermal Interface Materials Electronics Brochure
821.77 KB
8/7/2025
For New Energy Vehicle Inverters
3.31 MB
6/12/2025
