Thermal Gap Filler Pads
TGP6000
Excellent surface wetting designed for low contact resistance. Naturally tacky, and requires no additional adhesive which could inhibit thermal performance. (Grey color, 0.25 Thermal Impedance, 6.0 Thermal Conductivity, Hardness 40 on Shore 00)
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Overview
Solstice Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Solstice TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.
Typical Applications
• Consumer electronics
• Telecommunications & network servers
• Automotive electronics
• Power devices & modules
• Semiconductor logic & memory
Features
• High thermal performance
• Ultra-high compressibility for low stress applications
• Excellent surface wetting for low contact resistance
• High reliability
• Electrically insulating
Typical Applications
• Consumer electronics
• Telecommunications & network servers
• Automotive electronics
• Power devices & modules
• Semiconductor logic & memory
Features
• High thermal performance
• Ultra-high compressibility for low stress applications
• Excellent surface wetting for low contact resistance
• High reliability
• Electrically insulating
Typical Properties
Physical Properties
- Color
- Grey
- Hardness
- 40 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months
- Specific Gravity
- 3.3, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 6.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.25 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 8.5 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 3.79x1015 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- Gap Filler
- High Compressibility
- Key Features
- Low Oil Bleeding
- Industry
- Automotive
- Consumer Electronics
- Energy
- Technology and Telecommunications
Physical Properties
- Color
- Grey
- Hardness
- 40 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months
- Specific Gravity
- 3.3, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 6.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.25 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 8.5 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 3.79x1015 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- Gap Filler
- High Compressibility
- Key Features
- Low Oil Bleeding
- Industry
- Automotive
- Consumer Electronics
- Energy
- Technology and Telecommunications
- Color : Grey
- Thermal Conductivity : 6.0 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.25 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Specific Gravity : 3.3, Test Method ASTM D792
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Shelf Life : 12 months
- Hardness : 40 Shore00, Test Method ASTM D2240
- Format : Pad
- Dielectric Constant : 8.5 @ 1MHz, Test Method ASTM D150
- Volume Resistivity : 3.79x1015 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Key Features : Low Oil Bleeding
- Application : Gap Filler|High Compressibility
- Industry : Automotive|Consumer Electronics|Energy|Technology and Telecommunications
Application Note
Name
Description
File Size
Date
Size
Brochure
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Data Sheet
Name
Description
File Size
Date
Size
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Case Study
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Name
Description
File Size
Date
Size
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
5.99 MB
9/16/2026
Data Sheet
70.68 KB
9/17/2026
Case Study
909.42 KB
9/18/2026
