TGP8000HV

Solstice Thermal Gap Filler Pads (TGPs) provide high thermal performance with ease of use for many applications. Ultra-high compressibility enables low stress and excellent conformity to mating surfaces. Solstice TGP models are naturally tacky, and require no additional adhesive which could inhibit thermal performance. TGP models have been designed to minimize thermal resistance at interfaces, and maintain effective performance through reliability testing. TGP models are silicone based, therefore they offer a certain anti-shock effect, with electrical isolation and non-flammability.

Typical Applications
• Consumer electronics
• Telecommunications & network servers
• Automotive electronics
• Power devices & modules
• Semiconductor logic & memory

Features
• High thermal performance
• Ultra-high compressibility for low stress applications
• Excellent surface wetting for low contact resistance
• High reliability
• Electrically insulating