Thermal Grease
TG3000
Solstice silicone grease products provide superior thermal performance with ease of use across many applications. Provides low viscosity and inherent thixotropy for large-scale production with dispensing and screen and stencil printing. (3.0 W/m·K)
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Overview
High Thermal Conductivity Solstice silicone grease products provide superior thermal performance with ease of use across a multitude of applications. The low viscosity and inherent thixotropy make the technology a good fit for large-scale production with dispensing, screen printing and stencil printing. Thermal Grease is a common silicone thermal interface material, usually used to increase thermal contact conductance across jointed solid surfaces. Thermal interface materials occupy the space of air (a very poor thermal conductor) and fill in the gaps between two solid surfaces. This establishes an effective thermal path between a heat-generating component and a heat sink attached to it, greatly increasing thermal transfer efficiency.
Typical Applications
• CPU, GPU and chipsets
• LED assemblies
• Automotive electronics
• IGBT & power units
• Flipchip BGAs
• Range of thermal properties to fit different needs
Features
• Low viscosity and excellent thixotropy for dispensing or stencil/screen printing
• Range of BLT thicknesses
• Thermal resistance and thermal conductivity options for different power densities
• High stability and reliability
• Stable and homogeneous at room temperature storage
• Range of thermal properties to fit different needs
Typical Applications
• CPU, GPU and chipsets
• LED assemblies
• Automotive electronics
• IGBT & power units
• Flipchip BGAs
• Range of thermal properties to fit different needs
Features
• Low viscosity and excellent thixotropy for dispensing or stencil/screen printing
• Range of BLT thicknesses
• Thermal resistance and thermal conductivity options for different power densities
• High stability and reliability
• Stable and homogeneous at room temperature storage
• Range of thermal properties to fit different needs
Typical Properties
Physical Properties
- Bond-Line Thickness (BLT)
- 25 µm at 35 psi, 50 °C
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.7, Test Method ASTM D374
- Viscosity
- 150000 cps at 25 °C, Test Method Brookfield Viscometer
- Format
- Grease
Thermal Properties
- Thermal Conductivity
- 3.0 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- >10 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1.0x1012 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
General Information
- Application
- CPU
- Ease of Application
- GPU
- Power Device
- Thin Bondline
- Key Features
- Cost Effectiveness
- Typical Uses
- Flipchip BGAs
- IGBT
- LED assemblies
- Power Unit
- Storage Temperature
- Room Temperature
- Industry
- Automotive
- Technology and Telecommunications
Other
- Other Notes
- Available in 0.5kg can, 1kg can and 5 gallon pail
Physical Properties
- Bond-Line Thickness (BLT)
- 25 µm at 35 psi, 50 °C
- Color
- Grey
- Shelf Life
- 12 months
- Specific Gravity
- 2.7, Test Method ASTM D374
- Viscosity
- 150000 cps at 25 °C, Test Method Brookfield Viscometer
- Format
- Grease
Thermal Properties
- Thermal Conductivity
- 3.0 W/m-K, Test Method Hot Disk
- Thermal Impedance
- 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- >10 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 1.0x1012 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
- Working Temperature
- -40-150 °C
General Information
- Application
- CPU
- Ease of Application
- GPU
- Power Device
- Thin Bondline
- Key Features
- Cost Effectiveness
- Typical Uses
- Flipchip BGAs
- IGBT
- LED assemblies
- Power Unit
- Storage Temperature
- Room Temperature
- Industry
- Automotive
- Technology and Telecommunications
Other
- Other Notes
- Available in 0.5kg can, 1kg can and 5 gallon pail
- Color : Grey
- Bond-Line Thickness (BLT) : 25 µm at 35 psi, 50 °C
- Thermal Conductivity : 3.0 W/m-K, Test Method Hot Disk
- Thermal Impedance : 0.009 °C·in²/W, 35 psi, 50 °C, Test Method ASTM D5470
- Specific Gravity : 2.7, Test Method ASTM D374
- Shelf Life : 12 months
- Viscosity : 150000 cps at 25 °C, Test Method Brookfield Viscometer
- Format : Grease
- Dielectric Constant : >10 @ 1MHz, Test Method ASTM D150
- Volume Resistivity : 1.0x1012 ohm-cm, Test Method ASTM D257
- Working Temperature : -40-150 °C
- Flammability : V-0, Test Method UL94
- Storage Temperature : Room Temperature
- Typical Uses : Flipchip BGAs|IGBT|LED assemblies|Power Unit
- Key Features : Cost Effectiveness
- Application : CPU|Ease of Application|GPU|Power Device|Thin Bondline
- Industry : Automotive|Technology and Telecommunications
- Other Notes : Available in 0.5kg can, 1kg can and 5 gallon pail
Application Note
Name
Description
File Size
Date
Size
Brochure
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Data Sheet
Name
Description
File Size
Date
Size
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Case Study
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
5.99 MB
9/16/2026
Data Sheet
70.68 KB
9/17/2026
Case Study
909.42 KB
9/18/2026
