Thermal Putty Pads
TGP3500PT
Solstice Thermally Conductive Putty Pads TGPXXXXPT series enables excellent gap-filling capability for applications with large dimensional variances. (3.5 W/m·K, ultra soft pad)
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Overview
Solstice Thermally Conductive Putty Pads provide high thermal performance and solid thermal reliability. The material’s putty-like consistency enables excellent gap-filling capability for applications with large dimensional variances. Special surface reinforcement enables easier handling for operators, with no pull-out during high-volume assembly. The product is naturally tacky and requires no additional adhesive to mate to the heat source and heat sink.
Typical Applications
• EV battery & charging station
• Automotive electronics
• Power devices & modules
• Telecommunications & network servers
Features
• High thermal performance
• Ultra-soft
• High compressibility
• Excellent gap-filling capability
• Naturally tacky
Typical Applications
• EV battery & charging station
• Automotive electronics
• Power devices & modules
• Telecommunications & network servers
Features
• High thermal performance
• Ultra-soft
• High compressibility
• Excellent gap-filling capability
• Naturally tacky
Typical Properties
Physical Properties
- Color
- White
- Hardness
- 5 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months
- Specific Gravity
- 3.2, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.45 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 6.4 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.0x10\u00B9\u00B3 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- CPU
- GPU
- Gap Filler
- High Compressibility
- Memory
- Key Features
- Extra Soft
- Typical Uses
- EV battery & charging station
- Power devices & modules
- Telecommunications & network servers
- Sub-segment
- Camera
- GPS
- Server
- Industry
- Consumer Electronics
- Technology and Telecommunications
Physical Properties
- Color
- White
- Hardness
- 5 Shore00, Test Method ASTM D2240
- Shelf Life
- 12 months
- Specific Gravity
- 3.2, Test Method ASTM D792
- Thickness (mm)
- 0.5-5, Test Method ASTM D374
- Format
- Pad
Thermal Properties
- Thermal Conductivity
- 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance
- 0.45 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
Electrical Properties
- Dielectric Constant
- 6.4 @ 1MHz, Test Method ASTM D150
- Volume Resistivity
- 4.0x10\u00B9\u00B3 ohm-cm, Test Method ASTM D257
Flammability Properties
- Flammability
- V-0, Test Method UL94
General Information
- Application
- CPU
- GPU
- Gap Filler
- High Compressibility
- Memory
- Key Features
- Extra Soft
- Typical Uses
- EV battery & charging station
- Power devices & modules
- Telecommunications & network servers
- Sub-segment
- Camera
- GPS
- Server
- Industry
- Consumer Electronics
- Technology and Telecommunications
- Color : White
- Thermal Conductivity : 3.5 W/m-K, Test Method ASTM D5470
- Thermal Impedance : 0.45 °C·in²/W, 1 mm at 10 psi, Typical Value, Test Method ASTM D5470
- Specific Gravity : 3.2, Test Method ASTM D792
- Thickness (mm) : 0.5-5, Test Method ASTM D374
- Shelf Life : 12 months
- Hardness : 5 Shore00, Test Method ASTM D2240
- Format : Pad
- Dielectric Constant : 6.4 @ 1MHz, Test Method ASTM D150
- Volume Resistivity : 4.0x10\u00B9\u00B3 ohm-cm, Test Method ASTM D257
- Flammability : V-0, Test Method UL94
- Typical Uses : EV battery & charging station|Power devices & modules|Telecommunications & network servers
- Key Features : Extra Soft
- Sub-segment : Camera|GPS|Server
- Application : CPU|GPU|Gap Filler|High Compressibility|Memory
- Industry : Consumer Electronics|Technology and Telecommunications
Application Note
Name
Description
File Size
Date
Size
Brochure
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Data Sheet
Name
Description
File Size
Date
Size
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Case Study
Name
Description
File Size
Date
Size
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
application/pdf 5.99 MB
9/16/2026
5.99 MB
Case Study
application/pdf 909.42 KB
9/18/2026
909.42 KB
Data Sheet
application/pdf 91.54 KB
9/17/2026
91.54 KB
Data Sheet
application/pdf 70.68 KB
9/17/2026
70.68 KB
Phase Change Material Properties Chart
application/pdf 93.98 KB
9/16/2026
93.98 KB
Name
Description
File Size
Date
Size
Brochure - Thermal Interface Materials (TIMs)
5.99 MB
9/16/2026
Data Sheet
70.68 KB
9/17/2026
Case Study
909.42 KB
9/18/2026
